Cover of: 2001 6th International Conference on Solid-State and Integrated-Circuit Technology: Proceedings  | INTERNATIONAL CONFERENCE ON SOLID STATE

2001 6th International Conference on Solid-State and Integrated-Circuit Technology: Proceedings

October 22-25, 2001, Shanghai, China
  • 980 Pages
  • 2.98 MB
  • 8150 Downloads
  • English
by
Inst Elect & Electronic Engineers
Circuits & components, Electronic devices & materials, Electronics engineering, Technology, Technology & Industrial Arts, Science/Mathematics, General, Electronics - Circuits - Integrated, Electronics - Solid State, Congresses, Integrated Circuits, Solid State Electr
ContributionsPaul Yu (Editor)
The Physical Object
FormatPaperback
ID Numbers
Open LibraryOL10999981M
ISBN 100780365208
ISBN 139780780365209

Get this from a library. 6th International Conference on Solid-State and Integrated Circuit Technology proceedings, October, Shanghai, China. [Bing-Zong Li; Zhongguo dian zi xue hui.; Institute of Electrical and Electronics Engineers.

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6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT - Proceedings. Vol. 1 Institute of Electrical and Author: Ey Goo Kang, Seung Hyun Moon, Man Young Sung. 6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT - Proceedings: Editors: Hiroshi Iwai, Paul Yu, Bing-Zong Li, Guo-Ping Ru, Xin-Ping Qu: Publisher: Institute of Electrical and Electronics Engineers Inc.

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16th International Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS ), pp. ©IEEE: Sensors, MEMS, Packaging, High Temperature: Okojie, Nguyen, Savrun, Lukco: Zero offset drift suppression in SiC pressure sensors at C: Conference Paper: Proceedings IEEE Sensors ©IEEE:   Lu Junming; Shu Yan; Lin Zhenghui; Wang Ling,” A Novel transistor Low-power High-speed Full adder cell”, Proceedings of 6th International Conference on Solid-State and Integrated-Circuit Technology, vol-2, pp.

Google ScholarAuthor: Richa Saraswat, Shyam Akashe, Shyam Babu. * P. Chu, “ Plasma Immersion Ion Implantation of Semiconductors ”, Proceedings 6 th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT), Shanghai, China, pp. -October 22 – 25, Stefan Bengtsson is President and CEO of Chalmers University of Technology since August He is professor of solid-state electronics, with a research interest in micro- and nano-electronics, primarily silicon-based materials and devices.

He has published more than scientific articles in international journals and conference proceedings. In Proceedings of the 6th International Conference on Solid-State and Integrated Circuit Technology, Shanghai, China, 22–25 October ; pp.

– [Google Scholar] Saha, S.K. Compact Models for Integrated Circuit Design: Conventional Transistors and Beyond, 1st ed.; CRC Press: BocaAuthor: Dominik Mair, Manuel Ferdik, Christof Happ, Michael Renzler, Thomas Ussmueller.

Parts of this chapter have been sourced from a chapter in a book on Solid State Lighting Reliability [Pecht and Chang, Solid state lighting reliability: components to systems, Springer, New York.

Salman and E. Friedman, High Performance Integrated Circuit Design, McGraw-Hill Publishers,ISBNISBN Chinese translation by Publishing House of Electronics Industry,Chinese ISBN # The Properties of Epitaxial Pure Germanium Films on Silicon Substrate, Proceedings of the 6th International Conference on Solid-State and Integrated-Circuit Technology, Shanghai, China, 22–25 October ; pp.

–Cited by: 4. Articles in conference proceedings.

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Power 60GHz Transceiver with Integrated Baseband Circuitry," in IEEE International Solid-State Circuits Conference Digest of Technical model for double-gate MOSFET," in Proc. 8th Intl. Conf. on Solid-State and Integrated Circuit Technology (ICSICT), T. Tang, G. Ru, and Y.

Jiang, Eds. Publications of Professor Paul K Chu from to Click paper title to view the full paper using Acrobat Reader (A) Book Chapters. Chu and J.

Description 2001 6th International Conference on Solid-State and Integrated-Circuit Technology: Proceedings PDF

Ng, “Materials Characterization in Microelectronics Fabrication”, in Technology Road Maps for Hong Kong, C. Kao and K. Young (Eds.), The Chinese University Press, Hong Kong, Chapterpp. - (). “A comparison between RF MEMS switches and Semiconductor switches”, Proc.

IEEE International Conference on MEMS, NANO and Smart Systems (ICMENS’04), pp. –21, Aug. Kim, J.- I. and Peroulis, D., “ Tunable MEMS spiral inductors with optimized RF performance and integrated large-displacement electrothermal actuators ”, IEEE. Paschalidis N.

P., A Smart Sensor Integrated Circuit for NASA’s New Millennium Spacecraft, publication in the proceedings of the 6th IEEE International Conference on Electronic Circuit and Systems – ICECS ’99, W4F4, Pafos Cyprus September High performance SOI RF switches for wireless applications.

6th International Conference on Solid-State and Integrated Circuit Technology, ICSICT - Proceedings: Foreword. Article. Seo, W. Zhou, and Z.

Ma, "High-Speed Microwave Thin-Film Transistors Based on Transferrable Semiconductor Nanomembranes (Invited)", IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSSICT12), Oct.

Nov.1,Xi'an, China. Threshold Voltage Shift Instability Induced by Plasma Charging Damage in MOSFETS with High-K Dielectric. Proceedings of the 6th International Conference Reactive Plasmas and 23rd Symposium. Proceedings of the International Conference on Integrated Circuit Design and Technology,Cited by: 6.

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Home Browse by Title Proceedings KES'05 A general fuzzy min max neural network with compensatory neuron architecture. Share on. Authors: A. Nandedkar. Indian Institute of Technology, Kharagpur, India. Indian Institute of Technology, Kharagpur, India. View Profile, P.

Biswas. "A μm V SOI MHz 64 b Power PC Microprocessor with Copper Interconnects," Proceedings of the IEEE International Solid-State Circuits Conference, pp.

February 15 M. Naik et al., "Process Integration of Double Level Copper-Low k (k=) Interconnect," Proceedings of the IEEE International Interconnect Technology Cited by:   Author of Conference proceedings, DIPED, Intenational Electron Devices Meeting (Iedm) Proceedings, International Symposium on Power Semiconductor Devices and ICs (Ispsd) Proceedings, GaAs IC Symposium, ASMCIEEE Conference on.

International Conference Proceedings [Invited] Ryoichi Ishihara, Miki Trifunovic, Paolo Sberna and Tatsuya Shimoda, "Solution-Processed LTPS on Paper” in Proceeding of IDW ’15, The 22nd International Display Workshop, (Ohtsu, Japan), SID, December M. Cortez, S.

Hamdioui, and R. Ishihara, "Design dependent SRAM PUF robustness analysis", 16th Latin-American Test Symposium. Weiner, M. Jorgovanvic, A. Sahai, and B. Nikolic, "Design of a low-latency, high-reliability wireless communication system for control applications," in Proceedings of the IEEE International Conference on Communications,pp.

Ye Xu and T. Ytterdal, "A Low-Offset Dynamic Comparator Using Bulk Biasing Technique in Digital 65nm CMOS Technology,” in Proc. 10th International Conference on Solid-State and Integrated-Circuit Technology (ICSICT ), Nov.Shanghai, China, pp.International Conference on Solid-State Sensors, Actuators and Microsystems, pp.

Abstract An array of platinum electrodes has been integrated with analog and digital circuitry in standard CMOS technology for stimulation and recording of natural neural networks. Chen and J. Kolodzey, "Current transport mechanisms of Ge 1-y C y /Si heterojunction diodes," IBM Microelectronics, USA; University of Delaware, USA, The Sixth International Conference on Solid-State and Integrated-Circuit Technology (ICSICT ), Shanghai, China, October10th IEEE International Conference on Solid-State and Integrated Circuit Technology Proceedings: ICSICT Nov.

1- 4,Shanghai, China. Kun Yang, Terje Røste, Fritz Bekkadal and Torbjörn Ekman Channel characterization including path loss and Doppler effects with sea reflections of mobile radio propagation over sea at 2 GHz. [Contribution to a book, Contribution to a conference proceedings] Introducing a Cross-University Bachelor’s Programme with Orientation Semester - Enabling a Permeable Academic Education System In: Proceedings of the 20th International Conference on Research and Education in Mechatronics (REM ): University of Applied Sciences Upper Austria, Wels, Austria, May/ Peter.Proceedings, 4th International Conference on the Strength of Metals and Alloys,Westwood RC, Latanision RM.

Surface- and environment-sensitive mechanical behavior—Some current issues. Proceedings, 4th International Conference on the Strength of Metals and Alloys,Opperhauser, Jr., H, Westwood ARC.Conference Papers / Book Chapters.

C. S. Solaki, B. G "Evaluation of non-quasi-static effects during SEU in deep submicron MOS devices and circuits" in Proceedings of the 19th International Conference on Thin Film SOI MOSFETs" in Sixth International Conference on Solid-State and Integrated-Circuit Technology (ICSICT